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Outer Layer Expose & Develop

Making Circuit Boards Step 11

Photo Process

  • These steps again are similar to the inner process.  The expose process, although similar, has the basic concept reversed.  The photo tooling has been made to allow the polymerized areas to be where copper will be later removed.
  • Develop will chemically remove the resist on the surface features.  This now opens a pocket for additional plating and reveals the prior plated copper.